Atlas III+

Atlas® III+

Advanced Film & OCD Metrology System


The Atlas III+ thin film and OCD system is latest generation metrology tool for leading-edge 3D device manufacturing. By extending metrology performance to sub-angstrom precision and accuracy levels, the system enables advanced process control across a broad range of applications in high volume manufacturing. The Atlas family of products incorporate a proprietary spectroscopic reflectometry and spectroscopic ellipsometry solution, and when combined with Nanometrics’ industry leading Spectraprobe™ and NanoDiffract® OCD analysis software, enable process control of every critical manufacturing unit operation. The Atlas III+ and NanoDiffract solution provides insight of complex structure profiles across etch, clean, deposition and CMP steps.


Continued device scaling, use of novel materials and processes in foundry and DRAM as well as the emergence of high aspect ratio device architectures in advanced DRAM and 3D-NAND places increasing demands on process equipment, and control, driving the need for better precision and accuracy on features with extreme geometry. Additionally, such tighter process tolerances are driving more complex metrology strategies such as direct and in-die SRAM measurements as well as measurements across complex arrays in 3D devices. The Atlas III+ delivers best-in-class precision and repeatability at a faster overall system throughput, supporting a broad variety of process control applications. With NanoDiffract, the Atlas III+ enables high-fidelity metrology on the most complex 3D structures. When utilizing on-tool machine learning capability, the Atlas III+ provides unique insight into on-device and in-die control for advanced yield learning and process optimization.