Integrated Metrology

Integrated Metrology

OCD & Film Analysis System


The IMPULSE series integrated metrology systems combines two measurement technologies – ultra-violet optical critical dimension (OCD) using polarized spectroscopic reflectometry, and film measurements using deep ultra-violet (DUV) spectroscopic reflectometry. IMPULSE performs thin film and film stack thickness measurements on pads as well as oxide, nitride and trench profile measurements on arrays with nearly twice the throughput of prior generation systems and three times a tighter process control window.


The advanced mechano-optical designs and algorithms provide a complete measurement solution over the entire range of measurement requirements for each process step. This complete metrology capability is ideally suited for CMP applications, including dielectric, copper, tungsten and, poly-silicon; as well as a closed-loop process control for critical etch and lithography processes.