MEMS Manufacturing

Building MEMS devices introduces a new layer of complexity to a standard film stack. Polysilicon, amorphous silicon, dielectric layers, enriched materials with changing stoichiometry.


All of these require thickness measurement and control of optical constants. The newly introduced NanoSpec II delivers enhanced wavelength metrology along with the most advanced modeling engine in the industry. From very thin to very thick Si layers, polished to high roughness substrates, the Nanospec II will give customers the ability to monitor the process even at very narrow process windows. Besides thickness information, the Nanospec II also delivers information about the change in optical constants to help customers control their deposition process.


The ECVPro provides highly accurate carrier concentration profiles to check for the material and process stability.


The QS Series FTIR systems can rapidly monitor epitaxial grown layers, measure impurities in the material and substrate, and deliver high speed measurements, not building a bottleneck in an automated production environment.