Applications Level 1 Training

Training Course Objectives and Outline:
Upon successful completion of the course curriculum the student should have mastered the following course objectives.

• State why you need to measure film thickness
• Determine what is important in the measurement result
• Describe the principles of optical metrology
• Describe which technologies are available to measure film thickness
• Describe the concept of Stage Recipe, Film Strategy, Wafer Recipe, and Cassette Recipe
• Demonstrate use of the main screens and functions of N2000 software: Log in, Setup, Recipes, Processing, Database, etc.
• Demonstrate loading a wafer, running a measurement in Manual Mode using an existing Film Strategy, and checking the results
• Demonstrate creation of all the Stage Recipe types available for blanket wafers
• Demonstrate creation of a Wafer Recipe that uses a radial Stage Recipe and an existing Film Strategy, and display the results and the wafer map
• Demonstrate creation of a Cassette Recipe and run Cassette measurements
• State the principles of Pattern Recognition: Die, Deskew, Die Map, Die Group (of sites), Site PR, Teach Score, Search Score
• Demonstrate use of the N2000 pattern recognition functions
• Demonstrate creation of a complete Stage Recipe for a patterned wafer
• Describe the tips for selecting good pattern recognition images
• Demonstrate ability to export measurement data and import recipes
• Demonstrate the ability to export database and error logs
• Demonstrate the ablity to Reference the tool using the Reference Chip
• Describe why you need to measure critical dimension measurement
• Describe the basic OCD measurement principles
• Demonstrate measuring CD pads using an existing CD Film Strategy

Course Length: 3 days
Prerequisite Courses: None