Normal Incidence Scatterometry

Nanometrics Normal Incidence Scatterometry technology is a patented critical dimension measurement technology used to precisely determine the dimensions on the semiconductor wafer that directly control the resulting performance of the integrated circuit devices. This non-destructive, NI-OCD measurement technology is compatible with the current 90 nm manufacturing technology and can be extended below 65 nm for future requirements in both photolithography and etch applications.

NI-OCD combines non-contact optical technology with extremely powerful data analysis software to provide highly accurate measurement results for line width, height and sidewall angles. This technology is available in both standalone and integrated platforms.

Multi-Angle Scatterometry

Nanometrics holds key IP in the angular scatterometry field. Introduced to high-volume manufacturing as the CDS200, laser-based multi-angle scatterometry (MAS) is used on today’s 65 nm high-volume production applications. Continual development in this field has yielded significant advances for complex bi-periodic (2D) applications for next-generation process technologies and the deployment of powerful analytical tools.