Z3D 7200

The Z3D-7200 provides high precision surface metrology for high volume manufacturers of bulk silicon and specialty substrates, providing surface topography measurements with sub-angstrom vertical resolution over an extremely wide spatial domain (sub-micron to millimeters), and can also measure edge topography and wafer bow and stress.

Only the Z3D offers the ability to measure spatial wavelengths from sub-micron through the millimeter regime, filling the significant gap between contact AFM systems and full wafer topography tools. Using the 1X and 100X interferometric objectives exclusively offered by ZYGO, the Z3D-7200 provides the widest range of imaging options of any optical profiling system.

Whether in full High Volume Manufacturing, or in Process Development doing defect review, the Z3D-7200 has the performance and flexibility to meet your surface characterization requirements. The tool is normally configured with dual 300mm loadports but can be optionally configured as a bridge tool if you are in the transition process.

Key Features:

• Sub-Angstrom Vertical Resolution independent of objective selection
• Spatial wavelengths from < 0.5 µm to > 20 mm
• Roughness from < 0.1 nm to 100 µm
• Bow metrology from 5 µm to 3 mm
• Throughput > 40 WPH, 5 sites