UniFire 7900

Advanced Film Capability

The Advanced Film Capability (AFC) technology module enables measurement of multilayer films and topography of complex film stacks for in-line process control of Semiconductor manufacturing. AFC not only provides the industry's leading edge small spot ellipsometer, but also enhances surface topography beyond traditional approaches.

AFC extends the functionality of our single sensor, fully automated wafer metrology products: Z3D-7000 for FEOL process, Z3D-7200 for bare wafer and UniFire 7900 for litho and CMP process control. AFC delivers multi-angle, multi-wavelength ellipsometric film thickness metrology with an industry-leading small spot size, enabling design of smaller test targets for production monitoring at the 32nm process node and beyond.

AFC enhances standard interferometric topography with multilayer film thickness on the same platform in a completely automated fashion. Until now, chipmakers and thin film head manufacturers have used a combination of AFM, profilometry and destructive SEM-based dual-beam techniques to address process control of topography and thickness of complex film stacks. The combination of sub-angstrom topography measurement with high resolution ellipsometric film metrology provides a non-contact means to accurately measure topography and keep processes in control without resorting to destructive and/or slower contact techniques.