 |
 |
 |
 |
 |
 |
 |
|
|
|
|
|
|
|
Press Releases
|
Milpitas, California. February 17, 2004.
Nanometrics Announces Integration of NanoOCD/DUV 9010b into Leading Equipment Supplier’s Copper CMP Tool Nanometrics, Inc. (Nasdaq: NANO), a leading supplier of advanced integrated and standalone metrology equipment for the semiconductor industry, today announced that it has entered into an integrated metrology agreement with Lam Research Corporation. Under the agreement, Lam has integrated a Nanometrics’ NanoOCD/DUV 9010b film thickness mapping module into a CMP tool for post copper CMP erosion, oxide thickness and residue measurements. The NanoOCD/DUV 9010b has been qualified by Lam for monitoring of dielectric film thickness, erosion and copper residue. “This agreement with Lam is a validation of the benefits of Nanometrics’ flagship integrated metrology product during copper CMP,” said John Heaton, president and CEO of Nanometrics. “Because the integrated metrology capability was specifically requested by Lam’s customer, it is clear that the benefits of integrated metrology for copper CMP are understood by the marketplace.” Copper CMP presents new challenges to semiconductor manufacturers because it places heightened importance on the control of metal thickness uniformity, residuals and erosion. The NanoOCD/DUV 9010b combines both ultra violet optical critical dimension (OCD) spectroscopic ellipsometry and deep ultra violet (DUV) spectroscopic reflectometry to provide a comprehensive measurement solution for these challenges. “By integrating the NanoOCD/DUV 9010b into our CMP system, we are providing the capability to conduct necessary thickness, erosion and residue measurements without moving the wafer to a standalone metrology tool,” said Greg Amico, Lam’s senior director of product marketing. “This can significantly improve the process tuning cycle time for new products and devices and provide more immediate QC feedback in a production environment.” About Nanometrics: Contact: |
|