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Adopting semiconductor metrology to meet the challenges of MEMS manufacturing
[MICRO Magazine, April 2006]
MEMS manufacturers face the unique challenge of extending semiconductor manufacturing technologies to the fabrication of 3-D mechanical devices. For example, two of the most commercially important MEMS applications, accelerometers and ink-jet printheads, are typically made using processes derived from the semiconductor ..... [click
here for full article on MICRO's website] |
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Mask Metrology Using OCD for Profiling
[Solid State Technology, April 2005]
Optical critical-dimension (OCD) metrology or “scatterometry” has experienced rapid growth in sub-0.1µm wafer processes for both CD measurements and line profiling. The technology provides information not available from CD- and X-SEMs or AFMs, including detailed profiles of structures such as overhangs, undercuts, and sidewall angles.....
[click
here for full article on SST's website] |
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Integrated Metrology Adopts Stronger APC Role
[A. Braun, Semiconductor Int'l, May 2004]
Semiconductor process tolerances have now become incredibly tight,
and many tools have not been able to keep up with the newest process
control requirements. The only way to bring these process tools into
compliance with these tighter tolerances is by incorporating real-time
metrology.........[click
here for full article on SI's website] |
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Investigating the Impact of Backside Defect Inspection on Process
Development and Yields [MICRO Magazine, April 2004]
Shrinking device dimensions place aggressive demands on defect detection
metrology. As device density and critical dimension (CD) uniformity
requirements become more stringent, the maximum potential of lithography
can be exploited only if the quality of the incoming wafer is not
compromised........[click
here for full article on MICRO's website] |
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Normal-Incidence Polarized Reflectometry for Overlay Metrology
[Microlithography World, Feb/Mar 2004]
Normal-incidence polarized reflectance spectra of grating-on-grating
patterns provide a new, precise, and vibration-insensitive method
for measuring the overlay registration of patterned layers on product
wafers........[click
here for full article on SST's website]
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Smaller CDs Redefine Metrology
[A. Braun, Semiconductor Int'l,
February 2004]
CD metrology is becoming an interactive player within the process
flow — in lithography, at the track level, on the clean level,
and on the etch level. Everywhere there is an exponential interaction
increase in CD metrology, compared with previously. Integrated metrology
(IM) continues to acquire importance........[click
here for full article on SI's website] |
